The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Sep. 03, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Amilcar Arvelo, Poughkeepsie, NY (US);

Alan F. Benner, Poughkeepsie, NY (US);

Michael J. Ellsworth, Poughkeepsie, NY (US);

Eric J. McKeever, Poughkeepsie, NY (US);

Thong N. Nguyen, Poughkeepsie, NY (US);

Edward J. Seminaro, Milton, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); H04B 10/40 (2013.01); G02B 6/42 (2006.01); H01S 5/022 (2006.01); H01S 5/024 (2006.01); H01S 5/026 (2006.01); H01S 5/42 (2006.01); H04B 10/50 (2013.01); G02B 6/43 (2006.01);
U.S. Cl.
CPC ...
H04B 10/40 (2013.01); G02B 6/425 (2013.01); G02B 6/4246 (2013.01); G02B 6/4272 (2013.01); G02B 6/4286 (2013.01); G02B 6/4292 (2013.01); G02B 6/4295 (2013.01); G02B 6/4296 (2013.01); H01S 5/0228 (2013.01); H01S 5/0261 (2013.01); H01S 5/02476 (2013.01); H01S 5/423 (2013.01); H04B 10/503 (2013.01); G02B 6/428 (2013.01); G02B 6/43 (2013.01);
Abstract

Aspects of the present invention include an optical transceiver for providing transmission and reception of optical signals. The optical transceiver includes a carrier having two opposing surfaces and one or more openings extending from a first of the two opposing surfaces to a second of the two opposing surfaces. The optical transceiver includes a laser driver chip coupled to the first surface. The optical transceiver includes a vertical cavity surface emitting laser (VCSEL) array chip coupled to the first surface. The optical transceiver includes a photodetector array chip coupled to the first surface. The optical transceiver includes a receiver amplifier chip coupled to the first surface. The optical transceiver includes an optical coupling element coupled to the second surface. The VCSEL array chip and the photodetector array chip are disposed such that optical signals can pass through the one or more openings in the carrier.


Find Patent Forward Citations

Loading…