The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Nov. 26, 2013
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Eigo Kuwata, Tokyo, JP;

Koji Yamanaka, Tokyo, JP;

Hiroshi Otsuka, Tokyo, JP;

Tasuku Kirikoshi, Tokyo, JP;

Yoshitaka Kamo, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/191 (2006.01); H03F 1/56 (2006.01); H03F 1/42 (2006.01); H03F 3/60 (2006.01); H03F 3/04 (2006.01);
U.S. Cl.
CPC ...
H03F 1/565 (2013.01); H03F 1/42 (2013.01); H03F 1/56 (2013.01); H03F 3/04 (2013.01); H03F 3/601 (2013.01); H03F 3/602 (2013.01); H03F 3/191 (2013.01); H03F 2200/222 (2013.01); H03F 2200/318 (2013.01);
Abstract

Parallel capacitors (and) of impedance matching circuits () which are connected to two transistors (), respectively, have their first ends connected to a ground through via holes (and) that are used in common, respectively. Although a conventional circuit necessitates via holes by the number equal to the number of stages multiplied by the number of cells of the transistors () for an LPF type impedance matching circuit (), the present circuit can halve the number of via holes of the LPF type impedance matching circuit (), thereby being able to downsize the circuit.


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