The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Jul. 30, 2014
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Yuuichi Handa, Anjo, JP;

Katsutoyo Misawa, Kariya, JP;

Yuuki Takemoto, Kariya, JP;

Shotaro Yamasaki, Kariya, JP;

Shuji Kurauchi, Nagoya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02M 1/44 (2007.01); H02M 3/24 (2006.01); H02M 3/28 (2006.01); H01F 27/06 (2006.01);
U.S. Cl.
CPC ...
H02M 1/44 (2013.01); H01F 27/06 (2013.01); H02M 3/24 (2013.01); H02M 3/28 (2013.01);
Abstract

A power-supply apparatus is provided which includes a transformer, a primary semiconductor unit, a secondary semiconductor unit, and a secondary electronic device. Each of the primary semiconductor unit and the secondary semiconductor units has a plurality of semiconductor devices installed therein. The transformer, the primary semiconductor unit, the secondary semiconductor unit, and the secondary electronic device are electrically joined through connecting conductors. The transformer is laid on the primary semiconductor unit to make a first stack. Similarly, the secondary electronic device is laid on the secondary semiconductor unit. This permits the power-supply apparatus to be reduced in overall size thereof and minimizes adverse effects of electromagnetic noise to ensure the high efficiency in power supply operation.


Find Patent Forward Citations

Loading…