The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Oct. 17, 2014
Applicants:

Yazaki Corporation, Minato-ku, Tokyo, JP;

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventors:

Kei Sato, Makinohara, JP;

Hiroshi Aoki, Makinohara, JP;

Takahito Nakashima, Okazaki, JP;

Hiroshi Kobayashi, Okazaki, JP;

Hiroyasu Taga, Toyota, JP;

Assignees:

Yazaki Corporation, Tokyo, JP;

TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, Aichi-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/02 (2006.01); H01R 4/70 (2006.01); H01R 4/18 (2006.01); H01R 4/62 (2006.01); H01R 13/405 (2006.01);
U.S. Cl.
CPC ...
H01R 4/70 (2013.01); H01R 4/185 (2013.01); H01R 4/62 (2013.01); H01R 13/405 (2013.01);
Abstract

Provided is an electric wire with a terminal (), in which a resin portion () molded by a die covers a conductor exposure portion of a terminal () to which a conductor is connected. At least groove portion () is provided at a part of the terminal () covered with the resin portion () so that the groove portion () prevents the resin portion () from separating from the terminal () in a removing direction of the die after the resin portion () is molded by the die.


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