The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Jul. 18, 2014
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Franco Marconi, Milan, IT;

Fabio Morgia, Milan, IT;

Haiou Gou, Chengdu, CN;

Stefano Verzura, Milan, IT;

Guoyu Su, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 5/107 (2006.01); H01Q 9/04 (2006.01); H01P 3/08 (2006.01); H01P 3/12 (2006.01);
U.S. Cl.
CPC ...
H01P 5/107 (2013.01); H01P 3/081 (2013.01); H01P 3/121 (2013.01); H01Q 9/0407 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01);
Abstract

The invention relates to a surface mount microwave system, comprising a multilayer arrangement comprising a first conductive layer, a second conductive layer and a dielectric layer, wherein the first conductive layer is arranged on the dielectric layer, and wherein the dielectric layer is arranged on the second conductive layer, wherein the first conductive layer comprises a microwave circuit and wherein the second conductive layer forms a reference potential layer, a hollow microwave waveguide being at least partly formed in the second conductive layer, and a microwave transition structure for electromagnetically coupling the first conductive layer with the hollow microwave waveguide. According to some implementation forms, a reflector on a cover covering the multilayer arrangement may be avoided.


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