The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2017
Filed:
Sep. 29, 2010
Applicants:
Shunji Fukuda, Tokyo-to, JP;
Katsuya Sakayori, Tokyo-to, JP;
Yasuhiro Iizumi, Tokyo-to, JP;
Inventors:
Assignee:
DAI NIPPON PRINTING CO., LTD., Tokyo-to, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 1/62 (2006.01); H01L 51/52 (2006.01); B32B 15/08 (2006.01); C09J 7/02 (2006.01);
U.S. Cl.
CPC ...
H01L 51/529 (2013.01); B32B 15/08 (2013.01); C09J 7/0296 (2013.01); H01L 51/5243 (2013.01); H01L 51/5246 (2013.01); H01L 51/5259 (2013.01); C09J 2203/326 (2013.01); C09J 2400/163 (2013.01); C09J 2433/00 (2013.01); C09J 2467/00 (2013.01); C09J 2479/08 (2013.01); C09J 2479/086 (2013.01); C09J 2483/00 (2013.01); Y10T 428/24942 (2015.01);
Abstract
Provided is a heat-conductive sealing member which has high moisture barrier properties, has heat dissipation properties, and is capable of encapsulating an element by a simple method. The heat-conductive sealing member has a metal base material, an insulating layer that is formed on the metal base material, has heat conductivity and contains at least polyimide, and a tacky adhesive layer that is formed on the insulating layer and has heat resistance.