The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Sep. 04, 2015
Applicants:

Imec Vzw, Leuven, BE;

King Abdulaziz City for Science and Technology, Riyadh, SA;

Katholieke Universiteit Leuven, Leuven, BE;

Universiteit Hasselt, Hasselt, BE;

Inventors:

Hossam ElAnzeery, Cairo, EG;

Marie Buffiere, Echire, FR;

Marc Meuris, Keerbergen, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/032 (2006.01); H01L 21/02 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0326 (2013.01); H01L 21/0256 (2013.01); H01L 21/02422 (2013.01); H01L 21/02491 (2013.01); H01L 21/02557 (2013.01); H01L 21/02568 (2013.01); H01L 21/02614 (2013.01); H01L 31/032 (2013.01); H01L 31/18 (2013.01); Y02E 10/50 (2013.01);
Abstract

The disclosed technology generally relates to chalcogenide thin films, and more particularly to ternary and quaternary chalcogenide thin films having a wide band-gap, and further relates to photovoltaic cells containing such thin films, e.g., as an absorber layer. In one aspect, a method of forming a ternary or quaternary thin film chalcogenide layer containing Cu and Si comprises depositing a copper layer on a substrate. The method additionally comprises depositing a silicon layer on the copper layer with a [Cu]/[Si] atomic ratio of at least 0.7, and thereafter annealing in an inert atmosphere. The method further includes performing a first selenization or a first sulfurization, thereby forming a ternary thin film chalcogenide layer on the substrate. In another aspect, a composite structure includes a substrate having a service temperature not exceeding 600° C. and a ternary chalcogenide thin film or a quaternary chalcogenide thin film on the substrate, where the ternary or quaternary chalcogenide thin film comprises a selenide and/or a sulfide containing Cu and Si.


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