The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Oct. 10, 2011
Applicants:

Pierre-philippe Grand, Rousset, FR;

Salvador Jaime, Rousset, FR;

Philippe DE Gasquet, Rousset, FR;

Hariklia Deligianni, Yorktown Heights, NY (US);

Lubomyr T. Romankiw, Yorktown Heights, NY (US);

Raman Vaidyanathan, Yorktown Heights, NY (US);

Qiang Huang, Yorktown Heights, NY (US);

Shafaat Ahmed, Yorktown Heights, NY (US);

Inventors:

Pierre-Philippe Grand, Rousset, FR;

Salvador Jaime, Rousset, FR;

Philippe De Gasquet, Rousset, FR;

Hariklia Deligianni, Yorktown Heights, NY (US);

Lubomyr T. Romankiw, Yorktown Heights, NY (US);

Raman Vaidyanathan, Yorktown Heights, NY (US);

Qiang Huang, Yorktown Heights, NY (US);

Shafaat Ahmed, Yorktown Heights, NY (US);

Assignee:

NEXCIS, Rousset, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0264 (2006.01); C25D 5/10 (2006.01); C25D 7/06 (2006.01); C25D 21/12 (2006.01); H01L 31/032 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0264 (2013.01); C25D 5/10 (2013.01); C25D 7/0692 (2013.01); C25D 21/12 (2013.01); H01L 21/02521 (2013.01); H01L 31/0322 (2013.01); Y02E 10/541 (2013.01);
Abstract

The invention relates to manufacturing a I-III-VI compound in the form of a thin film for use in photovoltaics, including the steps of: a) electrodepositing a thin-film structure, consisting of I and/or III elements, onto the surface of an electrode that forms a substrate (SUB); and b) incorporating at least one VI element into the structure so as to obtain the I-III-VI compound. According to the invention, the electrodeposition step comprises checking that the uniformity of the thickness of the thin film varies by no more than 3% over the entire surface of the substrate receiving the deposition.


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