The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2017
Filed:
Feb. 03, 2016
Applicant:
Honeywell International Inc., Morristown, NJ (US);
Inventor:
Daniel Youngner, Maple Grove, MN (US);
Assignee:
Honeywell International Inc., Morris Plains, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 49/02 (2006.01); H01L 23/64 (2006.01); H01L 29/94 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/288 (2006.01); H01L 21/3205 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 28/40 (2013.01); H01L 21/02164 (2013.01); H01L 21/2885 (2013.01); H01L 21/32055 (2013.01); H01L 21/7684 (2013.01); H01L 21/76831 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/5223 (2013.01); H01L 23/642 (2013.01); H01L 24/03 (2013.01); H01L 24/08 (2013.01); H01L 29/945 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/08225 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01074 (2013.01);
Abstract
Devices, methods, and systems for ion trapping are described herein. One device includes a through-silicon via (TSV) and a trench capacitor formed around the TSV.