The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2017
Filed:
Feb. 24, 2016
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventors:
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 27/11582 (2017.01); H01L 29/06 (2006.01); H01L 27/11568 (2017.01); H01L 29/423 (2006.01); H01L 21/768 (2006.01); H01L 27/11578 (2017.01); H01L 27/06 (2006.01); H01L 21/822 (2006.01); H01L 27/11551 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/76877 (2013.01); H01L 21/8221 (2013.01); H01L 27/0688 (2013.01); H01L 27/11551 (2013.01); H01L 27/11568 (2013.01); H01L 27/11578 (2013.01); H01L 29/0649 (2013.01); H01L 29/42344 (2013.01); H01L 2224/32145 (2013.01);
Abstract
According to one embodiment, the plurality of contact vias extend in the stacking direction in the insulating layer, and are in contact with the end parts of the electrode layers. The plurality of second columnar parts extend in the stacking direction in the second stacked part, and include a plurality of second semiconductor bodies being different in length in the stacking direction.