The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Oct. 16, 2015
Applicant:

Spectrasensors, Inc., Rancho Cucamonga, CA (US);

Inventors:

Alfred Feitisch, Los Gatos, CA (US);

Gabi Neubauer, Los Gatos, CA (US);

Mathias Schrempel, Alta Loma, CA (US);

Assignee:

SpectraSensors, Inc., Rancho Cucamonga, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/022 (2006.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01); B23K 20/02 (2006.01); H01S 5/042 (2006.01); B23K 20/24 (2006.01); H01S 5/024 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B23K 20/023 (2013.01); B23K 20/24 (2013.01); H01L 33/62 (2013.01); H01S 5/0226 (2013.01); H01S 5/02256 (2013.01); H01S 5/02264 (2013.01); H01S 5/0425 (2013.01); B23K 2201/42 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83201 (2013.01); H01L 2924/12042 (2013.01); H01S 5/02212 (2013.01); H01S 5/02476 (2013.01);
Abstract

A first contact surface of a semiconductor laser chip can be formed to a first target surface roughness and a second contact surface of a carrier mounting can be formed to a second target surface roughness. A first bond preparation layer comprising a first metal can optionally be applied to the formed first contact surface, and a second bond preparation layer comprising a second metal can optionally be applied to the formed second contact surface. The first contact surface can be contacted with the second contact surface, and a solderless securing process can secure the semiconductor laser chip to the carrier mounting. Related systems, methods, articles of manufacture, and the like are also described.


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