The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Dec. 01, 2014
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Mamoru Kamikura, Chiyoda-ku, JP;

Keita Takahashi, Chiyoda-ku, JP;

Nobuyuki Haruna, Chiyoda-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/522 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H02M 7/00 (2006.01); H01L 23/498 (2006.01); H02M 7/68 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5225 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 23/3672 (2013.01); H01L 23/49838 (2013.01); H01L 24/36 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H02M 7/003 (2013.01); H02M 7/68 (2013.01); H01L 23/367 (2013.01); H01L 2224/40139 (2013.01); H01L 2224/40225 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/30107 (2013.01);
Abstract

A power semiconductor device includes a first polarity-side semiconductor element whose first principal electrode is in contact with a first polarity-side surface electrode on an insulator plate; a second polarity-side semiconductor element whose first principal electrode is in contact with an intermediate surface electrode on the insulator plate; an intermediate conductor connecting the intermediate surface electrode with a second principal electrode of the first polarity-side semiconductor element; a heatsink being in contact with the insulator plate; a sealing resin sealing the first polarity-side semiconductor element, the second polarity-side semiconductor element, the insulator plate, and the intermediate conductor; a second polarity-side terminal of plate-type connected with a second principal electrode of the second polarity-side semiconductor element and extending externally from the scaling resin; and an adjusting electrode mounted and connected to the heatsink so as to have a surface facing the second polarity-side terminal.


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