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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9646856 B1

PDFFull Text
Date of Patent:
May. 09, 2017

Filed:

May. 19, 2015

Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip

Applicant:

Intel Mobile Communications Gmbh, Neubiberg, DE;

Inventors:

Thorsten Meyer, Regensburg, DE;

Klaus Reingruber, Beratshausen, DE;

David O'Sullivan, Sinzing, DE;

Assignee:

Intel Deutschland GmbH, Neubiberg, DE;

Attorney:

Eschweiler & Potashnik, LLC

Primary Examiner:

Kevin Parendo

Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/304 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/311 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 21/02013 (2013.01); H01L 21/02016 (2013.01); H01L 21/304 (2013.01); H01L 21/311 (2013.01); H01L 21/56 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/3157 (2013.01); H01L 23/3185 (2013.01); H01L 24/02 (2013.01); H01L 24/13 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/96 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/2064 (2013.01);
Abstract

A method of manufacturing a device includes providing a semiconductor chip having a first face and a second face opposite to the first face with a contact pad arranged on the first face. The semiconductor chip is placed on a carrier with the first face facing the carrier. The semiconductor chip is encapsulated with an encapsulation material. The carrier is removed and the semiconductor material is removed from the second face of the first semiconductor chip without removing encapsulation material at the same time.

Find Patent Forward Citations

Meyer, Thorsten. (2017). Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip (U.S. Patent No. 9646856). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9646856

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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