The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Dec. 26, 2012
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Hiroshi Tamagawa, Kyoto, JP;

Hiroki Yamamoto, Kyoto, JP;

Katsuya Matsuura, Kyoto, JP;

Yasuhiro Kondo, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 10/50 (2006.01); H01G 5/38 (2006.01); H01G 5/40 (2006.01); H01F 29/00 (2006.01); H01F 27/40 (2006.01); H01L 25/10 (2006.01); H01G 5/011 (2006.01); H01C 1/14 (2006.01); H01L 27/15 (2006.01); H01L 33/62 (2010.01); H01L 25/13 (2006.01); H01C 10/16 (2006.01); H01F 27/28 (2006.01); H01L 27/08 (2006.01); H01C 17/23 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01); H01C 17/00 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01C 10/50 (2013.01); H01C 1/14 (2013.01); H01C 10/16 (2013.01); H01C 17/23 (2013.01); H01F 27/2804 (2013.01); H01F 27/40 (2013.01); H01F 29/00 (2013.01); H01G 5/011 (2013.01); H01G 5/38 (2013.01); H01G 5/40 (2013.01); H01L 24/32 (2013.01); H01L 25/105 (2013.01); H01L 25/13 (2013.01); H01L 27/0802 (2013.01); H01L 27/15 (2013.01); H01L 33/62 (2013.01); H05K 3/3442 (2013.01); H05K 3/3478 (2013.01); H01C 17/006 (2013.01); H01F 17/0006 (2013.01); H01L 2221/68304 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/181 (2013.01); H01L 2924/351 (2013.01); H05K 2201/10212 (2013.01); H05K 2203/0415 (2013.01); Y02P 70/613 (2015.11);
Abstract

A chip component includes a substrate, an element circuit network including a plurality of element parts formed on the substrate, an external connection electrode provided on a surface of the substrate to provide external connection for the element circuit network, a plurality of fuses formed on the substrate and disconnectably connecting each of the plurality of element parts to the external connection electrode, a solder layer formed on an external connection terminal of the external connection electrode and a resin film which covers the surface of the substrate and other surface which intersects the surface of the substrate.


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