The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2017
Filed:
Aug. 07, 2014
Applicant:
Samsung Display Co., Ltd., Yongin, Gyeonggi-do, KR;
Inventors:
Hyunwoo Koo, Gyeonggi-do, KR;
Taewoong Kim, Gyeonggi-do, KR;
Sunho Kim, Gyeonggi-do, KR;
Danbi Choi, Gyeonggi-do, KR;
Assignee:
SAMSUNG DISPLAY CO., LTD., Yongin, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1333 (2006.01); B29C 70/88 (2006.01); B29L 9/00 (2006.01); B29L 31/34 (2006.01); B29K 79/00 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133305 (2013.01); B29C 70/88 (2013.01); B29K 2079/08 (2013.01); B29L 2009/00 (2013.01); B29L 2031/3475 (2013.01); G02F 2202/28 (2013.01); Y10T 428/1064 (2015.01);
Abstract
A device substrate manufacturing method includes forming a debonding layer on a carrier substrate. An inorganic adhesive layer is formed on at least a portion of the debonding layer. A process substrate is formed on the carrier substrate. A device is formed on the process substrate, and the process substrate is separated from the carrier substrate.