The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Jul. 16, 2013
Applicant:

Illinois Tool Works Inc., Glenview, IL (US);

Inventors:

Lawrence L. Freson, Lake Bluff, IL (US);

Kurt G. Adair, Lake Bluff, IL (US);

Charles E. Shewey, Lake Bluff, IL (US);

Douglas A. Ceckowski, Lake Bluff, IL (US);

Sean O'Flaherty, Lake Bluff, IL (US);

Anatoly Gosis, Palatine, IL (US);

Yury Shkolnikov, Glenview, IL (US);

Michael F. Hart, Mundelein, IL (US);

Daniel P. Schmidt, Deerfield, IL (US);

Assignee:

ILLINOIS TOOL WORKS INC., Glenview, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 1/22 (2006.01); G01N 1/36 (2006.01); B30B 11/02 (2006.01); B30B 15/34 (2006.01); B30B 11/04 (2006.01); G01K 13/00 (2006.01);
U.S. Cl.
CPC ...
G01N 1/36 (2013.01); B30B 11/02 (2013.01); B30B 11/04 (2013.01); B30B 15/34 (2013.01); G01K 13/00 (2013.01); G01N 2001/364 (2013.01);
Abstract

A sample encapsulation system includes a base, a chamber having an inlet and a chamber housing in which the chamber is housed. The chamber is fixedly mounted at least in part within the housing and the housing is movably mounted to the base. The system includes a cap, a first ram operably mounted to the cap for engaging the chamber inlet and a second ram positioned in the chamber opposite the inlet. The second ram is movable toward and away from the first ram. The chamber and housing are movable toward the cap for engaging the first ram with the chamber inlet during an encapsulation cycle and away from the cap, disengaging the first ram from the chamber inlet following an encapsulation cycle. The system includes heating and cooling assemblies and a temperature sensor located remotely from the chamber interior to automatically isolate cooling water to the system.


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