The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Jun. 20, 2014
Applicant:

Omron Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Koichi Takemura, Saitama, JP;

Tomofusa Shibata, Saitama, JP;

Yoshinori Ito, Saitama, JP;

Yoshikaga Taguchi, Shiga, JP;

Yoshihisa Yamanaka, Saitama, JP;

Kenji Suzuki, Saitama, JP;

Kazutaka Kaneko, Saitama, JP;

Masayuki Kojima, Saitama, JP;

Yuzuru Fujie, Saitama, JP;

Naoki Hashimoto, Saitama, JP;

Taichi Suzuki, Saitama, JP;

Assignee:

OMRON Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/46 (2006.01); B29D 11/00 (2006.01); B29C 43/04 (2006.01); B29C 43/02 (2006.01);
U.S. Cl.
CPC ...
B29D 11/00663 (2013.01); B29C 43/04 (2013.01); B29D 11/00288 (2013.01); B29C 2043/025 (2013.01); B29C 2043/046 (2013.01); B29C 2043/463 (2013.01);
Abstract

A transfer molding method includes supplying melted resin to a first metallic mold, conveying the first metallic mold onto which the resin was supplied to a position opposing a second metallic mold, performing transfer molding by sandwiching the resin between the two metallic molds, and cooling the resin after performing transfer molding. The performing transfer molding includes discharging residual air that remains in a recess via a groove portion.


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