The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Nov. 14, 2012
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Uwe Liskow, Asperg, DE;

Peter Klobes, Bietigheim, DE;

Thomas Meier, Oberriexingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 5/00 (2006.01); H05K 7/20 (2006.01); F16H 61/00 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20854 (2013.01); F16H 61/0006 (2013.01); H05K 1/0204 (2013.01); H05K 3/301 (2013.01); H05K 5/0082 (2013.01); H05K 7/209 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H05K 1/142 (2013.01); Y10T 29/4913 (2015.01);
Abstract

A control device includes a first circuit carrier with electrical components that are electrically conductively connected to one another and a second circuit carrier with electrical components that are electrically conductively connected to one another. The first circuit carrier and the second circuit carrier are electrically conductively connected to one another. The second circuit carrier is fixedly connected in thermally conductive fashion to a fluid-tight thermally conductive carrier element. The second circuit carrier and the carrier element are arranged in a cutout of the first circuit carrier. The carrier element has better thermal conductivity than the first circuit carrier and can be thermally conductively connected to a heat sink. The carrier element is integrated in fluid-tight fashion in an internal region of the first circuit carrier.


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