The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Mar. 14, 2013
Lg Innotek Co., Ltd., Seoul, KR;
Myoung Hwa Nam, Seoul, KR;
Byeong Ho Kim, Seoul, KR;
Yeong Uk Seo, Seoul, KR;
Hyun Seok Seo, Seoul, KR;
Chang Woo Yoo, Seoul, KR;
Sang Myung Lee, Seoul, KR;
LG INNOTEK CO., LTD., Seoul, KR;
Abstract
A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer.