The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Nov. 20, 2015
Applicant:

Polyera Corporation, Skokie, IL (US);

Inventors:

Hjalmar Edzer Ayco Huitema, Belmont, CA (US);

Kwok Wah Mok, Valkenswaard, NL;

Assignee:

Flexterra, Inc., Skokie, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G04G 17/04 (2006.01); G04G 17/08 (2006.01); G06F 1/16 (2006.01); G09F 9/30 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01); H05K 1/03 (2006.01); H05K 7/02 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); G04G 17/045 (2013.01); G04G 17/08 (2013.01); G06F 1/16 (2013.01); G06F 1/163 (2013.01); G06F 1/1652 (2013.01); G09F 9/30 (2013.01); H01L 51/0097 (2013.01); H01L 51/56 (2013.01); H05K 1/028 (2013.01); H05K 1/0274 (2013.01); H05K 1/0306 (2013.01); H05K 7/02 (2013.01); H05K 13/04 (2013.01); G09F 9/301 (2013.01); H01L 2251/5338 (2013.01); Y02E 10/549 (2013.01);
Abstract

A method for mounting a flexible electronics component to a support structure includes bending the flexible electronics component to be aligned with a curved contour. The curved contour is determined based on a flexibility requirement of a product in which the flexible electronics component is to be integrated and one or more flexibility constraints of the flexible electronics component. The method also includes bending the support structure to be aligned with the curved contour, and adhering the bent flexible electronics component to the bent support structure to produce a flexible electronics assembly.


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