The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Feb. 27, 2015
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventor:

Graham Kirsch, Bramley, GB;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04N 3/14 (2006.01); H04N 5/335 (2011.01); H04N 5/228 (2006.01); H04N 5/372 (2011.01); H04N 5/341 (2011.01); H04N 5/345 (2011.01); H04N 5/376 (2011.01); H04N 5/378 (2011.01);
U.S. Cl.
CPC ...
H04N 5/372 (2013.01); H04N 5/341 (2013.01); H04N 5/3454 (2013.01); H04N 5/376 (2013.01); H04N 5/378 (2013.01); H04N 5/3765 (2013.01);
Abstract

Electronic devices may include image sensors having configurable image sensor pixel interconnections. Image sensors may include image sensor pixels coupled to analog circuitry via configurable interconnect circuitry. The analog circuitry may include many analog circuit blocks. The analog circuit blocks may control and read out signals from associated image sensor pixels. The configurable interconnect circuitry may be controlled to reroute the connections between the analog circuit blocks and specific groups of image sensor pixels. Digital circuitry may be coupled to the analog circuitry via configurable interconnect circuitry. The digital circuitry may include digital circuit blocks. There may be significantly more image pixels controlled by a small number of analog circuit blocks, which are in turn controlled by a smaller number of digital circuit blocks. The image sensor pixel array, the configurable interconnect circuitry, the analog circuitry, and the digital circuitry may be vertically stacked.


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