The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Nov. 16, 2015
Applicant:
Renesas Electronics Corporation, Tokyo, JP;
Inventors:
Kazuhiro Mitamura, Tokyo, JP;
Koji Bando, Tokyo, JP;
Yukihiro Sato, Tokyo, JP;
Takamitsu Kanazawa, Tokyo, JP;
Assignee:
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02M 7/537 (2006.01); H01L 27/06 (2006.01); H01L 29/739 (2006.01); H01L 29/861 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H02M 7/00 (2006.01); H02P 27/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H02M 7/537 (2013.01); H01L 23/3107 (2013.01); H01L 23/49551 (2013.01); H01L 23/49555 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 24/49 (2013.01); H01L 27/0664 (2013.01); H01L 29/7397 (2013.01); H01L 29/861 (2013.01); H02M 7/003 (2013.01); H01L 24/06 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H02P 27/06 (2013.01);
Abstract
For example, a semiconductor device has a lead connected to a second portion of a chip mounting part on which a semiconductor chip to be a heat source is mounted and a lead connected to a third portion of the chip mounting part on which the semiconductor chip to be the heat source is mounted. Further, each of the leads has a protruding portion protruding from a sealing member. In this manner, it is possible to enhance a heat dissipation characteristic of the semiconductor device.