The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Feb. 04, 2014
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Kentaro Miura, Kanagawa-ken, JP;

Tatsunori Sakano, Kanagawa-ken, JP;

Tomomasa Ueda, Kanagawa-ken, JP;

Nobuyoshi Saito, Tokyo, JP;

Shintaro Nakano, Kanagawa-ken, JP;

Yuya Maeda, Kanagawa-ken, JP;

Hajime Yamaguchi, Kanagawa-ken, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/08 (2010.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 33/08 (2013.01); H01L 51/003 (2013.01); H01L 27/3246 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); H01L 2251/566 (2013.01);
Abstract

According to one embodiment, a method for manufacturing a display element is disclosed. The method can include forming a peeling layer, forming a resin layer, forming a barrier layer, forming an interconnect layer, forming a display layer, and removing. The peeling layer is formed on a major surface of a base body. The major surface has first, second, and third regions. The peeling layer includes first, second, and third peeling portions. The resin layer is formed on the peeling layer. The resin layer includes first and second resin portions. The barrier layer is formed on the first, second, and third peeling portions. The interconnect layer is formed on the barrier layer. The display layer is formed on the interconnect layer. The first peeling portion is removed from the first resin portion and the second peeling portion is removed from the second resin portion.


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