The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Jun. 23, 2016
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Inventors:

Shinya Sasagawa, Chigasaki, JP;

Hitoshi Nakayama, Atsugi, JP;

Masashi Tsubuku, Atsugi, JP;

Daigo Shimada, Atsugi, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/12 (2006.01); H01L 29/66 (2006.01); H01L 29/49 (2006.01); H01L 29/45 (2006.01); H01L 29/786 (2006.01); H01L 27/088 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66969 (2013.01); H01L 27/088 (2013.01); H01L 27/1214 (2013.01); H01L 27/1225 (2013.01); H01L 27/1288 (2013.01); H01L 29/45 (2013.01); H01L 29/4908 (2013.01); H01L 29/7869 (2013.01);
Abstract

When a transistor having bottom gate bottom contact structure is manufactured, for example, a conductive layer constituting a source and a drain has a three-layer structure and two-step etching is performed. In the first etching process, an etching method in which the etching rates for at least the second film and the third film are high is employed, and the first etching process is performed until at least the first film is exposed. In the second etching process, an etching method in which the etching rate for the first film is higher than that in the first etching process and the etching rate for a 'layer provided below and in contact with the first film' is lower than that in the first etching process is employed. The side wall of the second film is slightly etched when a resist mask is removed after the second etching process.


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