The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Oct. 17, 2014
Applicant:

Cree, Inc., Durham, NC (US);

Inventor:

Helmut Hagleitner, Zebulon, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/49 (2006.01); H01L 29/778 (2006.01); H01L 29/812 (2006.01); H01L 29/417 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/402 (2013.01); H01L 29/4958 (2013.01); H01L 29/66068 (2013.01); H01L 29/66462 (2013.01); H01L 29/66568 (2013.01); H01L 29/66863 (2013.01); H01L 29/7786 (2013.01); H01L 29/78 (2013.01); H01L 29/8128 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/41766 (2013.01);
Abstract

A transistor device includes a semiconductor body, a spacer layer, and a field plate. The spacer layer is over at least a portion of a surface of the semiconductor body. The field plate is over at least a portion of the spacer layer, and includes a semiconductor layer between a first refractory metal interposer layer and a second refractory metal interposer layer. By including the semiconductor layer between the first refractory metal interposer layer and the second refractory metal interposer layer, the electromigration of metals in the field plate is significantly reduced. Since electromigration of metals in the field plate is a common cause of transistor device failures, reducing the electromigration of metals in the field plate improves the reliability and lifetime of the transistor device.


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