The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

May. 14, 2013
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Mrinal K. Das, Durham, NC (US);

Robert J. Callanan, Raleigh, NC (US);

Henry Lin, Chapel Hill, NC (US);

John Williams Palmour, Cary, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/16 (2006.01); H01L 27/06 (2006.01); H01L 21/04 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 25/18 (2006.01); H05K 7/14 (2006.01); H01L 29/66 (2006.01); H01L 29/04 (2006.01); H02M 7/00 (2006.01); H02M 7/5387 (2007.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H02P 7/03 (2016.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 21/046 (2013.01); H01L 21/049 (2013.01); H01L 25/18 (2013.01); H01L 27/0629 (2013.01); H01L 29/0696 (2013.01); H01L 29/7395 (2013.01); H01L 29/7802 (2013.01); H05K 7/1432 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 25/072 (2013.01); H01L 29/045 (2013.01); H01L 29/66068 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/30107 (2013.01); H02M 7/003 (2013.01); H02M 7/5387 (2013.01); H02P 7/04 (2016.02);
Abstract

The present disclosure relates to a power module that has a housing with an interior chamber and a plurality of switch modules interconnected to facilitate switching power to a load. Each of the plurality of switch modules comprises at least one transistor and at least one diode mounted within the interior chamber and both the at least one transistor and the at least one diode are majority carrier devices, are formed of a wide bandgap material system, or both. The switching modules may be arranged in virtually any fashion depending on the application. For example, the switching modules may be arranged in a six-pack, full H-bridge, half H-bridge, single switch or the like.


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