The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Dec. 08, 2015
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Byung Yeon Choi, Seoul, KR;
Hee Young Beom, Seoul, KR;
Yong Gyeong Lee, Seoul, KR;
Ji Hwan Lee, Seoul, KR;
Hyun Seoung Ju, Seoul, KR;
Gi Seok Hong, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 31/00 (2006.01); H01L 27/15 (2006.01); H01L 33/40 (2010.01); H01L 33/46 (2010.01); H01L 33/10 (2010.01); H01L 33/06 (2010.01); H01L 33/14 (2010.01); H01L 33/62 (2010.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); H01L 33/06 (2013.01); H01L 33/10 (2013.01); H01L 33/145 (2013.01); H01L 33/40 (2013.01); H01L 33/46 (2013.01); H01L 33/62 (2013.01); H01L 33/32 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A light emitting structure includes lower and upper semiconductor layers having different conductive types, and an active layer disposed between the lower and upper semiconductor layers. The light emitting structure is provided on the substrate. A first electrode layer provided on the upper semiconductor layer includes a first adhesive layer and a first bonding layer overlapping each other. A reflective layer is not provided between the first adhesive layer and the first bonding layer.