The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Sep. 04, 2014
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventor:

Norimune Orimoto, Toyota, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 23/492 (2006.01); H01L 23/495 (2006.01); H01L 23/16 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/4882 (2013.01); H01L 21/565 (2013.01); H01L 23/16 (2013.01); H01L 23/3114 (2013.01); H01L 23/3672 (2013.01); H01L 23/492 (2013.01); H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H01L 23/3121 (2013.01); H01L 2224/32245 (2013.01);
Abstract

A semiconductor device, including: an intermediate plate; a semiconductor element connected to one of surfaces of the intermediate plate by a brazing filler metal; a main plate connected to the other one of the surfaces of the intermediate plate by a brazing filler metal; and a resin layer, the intermediate plate having an external region extending to an outer side with respect to a region in which the intermediate plate is connected to the brazing filler metal, a first through-hole extending through the intermediate plate in the external region, the resin layer covering at least the brazing filler metal, the intermediate plate and a surface of the main plate in which the main plate faces the intermediate plate, the resin layer being also arranged inside the first through-hole.


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