The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

May. 27, 2015
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Mukul Gupta, San Diego, CA (US);

Xiangdong Chen, San Diego, CA (US);

Ohsang Kwon, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 27/088 (2006.01); G06F 1/10 (2006.01); G06F 17/50 (2006.01); H01L 27/02 (2006.01); H01L 27/118 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); G06F 1/10 (2013.01); G06F 17/5068 (2013.01); H01L 27/0207 (2013.01); H01L 27/088 (2013.01); H01L 27/11807 (2013.01); H01L 23/5286 (2013.01); H01L 2027/11875 (2013.01); H01L 2027/11879 (2013.01);
Abstract

A MOS device includes first, second, third, and fourth interconnects. The first interconnect extends on a first track in a first direction. The first interconnect is configured in a metal layer. The second interconnect extends on the first track in the first direction. The second interconnect is configured in the metal layer. The third interconnect extends on a second track in the first direction. The third interconnect is configured in the metal layer. The second track is parallel to the first track. The third interconnect is coupled to the second interconnect. The second and third interconnects are configured to provide a first signal. The fourth interconnect extends on the second track in the first direction. The fourth interconnect is configured in the metal layer. The fourth interconnect is coupled to the first interconnect. The first and fourth interconnects are configured to provide a second signal different than the first signal.


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