The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Feb. 03, 2014
Panasonic Intellectual Property Management Co., Ltd., Osaka-shi, Osaka, JP;
Zyunya Tanaka, Osaka, JP;
Abstract
A semiconductor device of the present invention includes: a first substrate () on which a power semiconductor element () is mounted; a heat-dissipating plate (); an insulating layer () disposed between the first substrate () and the heat-dissipating plate (); and molding resin () that molds the first substrate (), the heat-dissipating plate (), and the insulating layer (). The heat-dissipating plate () has a first surface opposite to the insulating layer (), the first surface being exposed from the molding resin (). The insulating layer () has a curved area () that is curved to the first surface and an end that is located in the molding resin ().