The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Sep. 25, 2014
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Mahiro Tsujino, Kyoto, JP;

Daisuke Sakumoto, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/047 (2006.01); H01L 23/057 (2006.01); H01G 4/224 (2006.01); H01L 23/492 (2006.01); H01L 33/48 (2010.01); H01S 5/022 (2006.01); H01G 2/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/047 (2013.01); H01G 4/224 (2013.01); H01L 23/057 (2013.01); H01L 23/492 (2013.01); H01L 33/483 (2013.01); H01S 5/02208 (2013.01); H01S 5/02248 (2013.01); H01G 2/10 (2013.01); H01L 33/48 (2013.01); H01L 2924/0002 (2013.01); H01S 5/02216 (2013.01); H01S 5/02284 (2013.01);
Abstract

An electronic component housing package has an input/output member that is bonded to a hole part of a frame body via a brazing material. This input/output member has a top surface that is bonded to first side wall parts and a second side wall part inside the first side wall parts, and the top surface is provided with a narrow part having a narrow width at a portion that is bonded to the first side wall part. When the input/output member is bonded, the flow of the brazing material on the top surface can be controlled by the narrow part.


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