The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Apr. 08, 2014
Applicant:
Wai Yew Lo, Petaling Jaya, MY;
Inventor:
Wai Yew Lo, Petaling Jaya, MY;
Assignee:
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); H01L 23/495 (2006.01); H01L 25/04 (2014.01); G01L 19/00 (2006.01); G01L 19/06 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0052 (2013.01); G01L 19/0069 (2013.01); G01L 19/06 (2013.01); H01L 23/4951 (2013.01); H01L 23/49503 (2013.01); H01L 23/49513 (2013.01); H01L 25/041 (2013.01); B81B 2201/0228 (2013.01); B81B 2201/0264 (2013.01);
Abstract
A cavity-down pressure sensor device has a pressure-sensing die that is electrically connected to a master control unit (MCU) using face-to-face bonding. Connecting the pressure-sensing die in this manner avoids the need to wire bond the pressure-sensing die to the master control unit.