The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Sep. 02, 2013
Applicant:
Cheil Industries Inc., Gumi-si, KR;
Inventors:
Seon-Ae Lee, Uiwang-si, KR;
Young-Sin Kim, Uiwang-si, KR;
Min-Young Lim, Uiwang-si, KR;
Kang-Yeol Park, Uiwang-si, KR;
Assignee:
Samsung SDI Co., Ltd., Yongin-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 55/02 (2006.01); C08K 3/08 (2006.01); C08K 9/00 (2006.01); C08J 7/04 (2006.01); C08L 101/00 (2006.01); C08K 9/02 (2006.01);
U.S. Cl.
CPC ...
C08L 55/02 (2013.01); C08J 7/042 (2013.01); C08K 3/08 (2013.01); C08K 9/02 (2013.01); C08L 101/00 (2013.01); C08J 2325/06 (2013.01); C08J 2400/24 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); C08L 2207/04 (2013.01);
Abstract
A resin composition includes (A) a thermoplastic resin, (B) a first metal layer-resin composite particle including a first metal layer and first thermosetting resin coating layers positioned on the first metal layer and (C) a second metal layer-resin composite particle including a second metal layer and second thermosetting resin coating layers positioned on the second metal layer, and a molded article using the same.