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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9637461 B1

PDFFull Text
Date of Patent:
May. 02, 2017

Filed:

Sep. 29, 2014

Electrical connection structure

Applicants:

Autonetworks Technologies, Ltd., Yokkaichi-shi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi-shi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Kyushu University, National University Corporation, Fukuoka-shi, Fukuoka, JP;

Inventors:

Hideki Nomura, Yokkaichi, JP;

Hiroki Hirai, Yokkaichi, JP;

Junichi Ono, Yokkaichi, JP;

Takuji Ootsuka, Yokkaichi, JP;

Takehiro Hosokawa, Yokkaichi, JP;

Tatsuya Hase, Yokkaichi, JP;

Kazuo Nakashima, Yokkaichi, JP;

Kazuhiro Goto, Osaka, JP;

Makoto Mizoguchi, Fukuoka, JP;

Assignees:

AUTONETWORKS TECHNOLOGIES, LTD., Mie, JP;

SUMITOMO WIRING SYSTEMS, LTD., Mie, JP;

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;

KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION, Fukuoka-Shi, JP;

Attorney:

Oliff PLC

Primary Examiner:

Timothy Thompson

Assistant Examiner:

Krystal Robinson

Int. Cl.
CPC ...
C07D 249/18 (2006.01); H01R 4/62 (2006.01); H01R 13/03 (2006.01); C23F 11/14 (2006.01); C23F 11/167 (2006.01); H01B 7/28 (2006.01); C23F 11/10 (2006.01); C23F 11/16 (2006.01); H01B 3/20 (2006.01); C10M 137/08 (2006.01); B32B 15/01 (2006.01); C22C 9/00 (2006.01); C22C 13/00 (2006.01); C07D 235/04 (2006.01); C07D 277/72 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
C07D 249/18 (2013.01); B32B 15/01 (2013.01); C07D 235/04 (2013.01); C07D 277/72 (2013.01); C10M 137/08 (2013.01); C22C 9/00 (2013.01); C22C 13/00 (2013.01); C23F 11/10 (2013.01); C23F 11/149 (2013.01); C23F 11/165 (2013.01); C23F 11/1673 (2013.01); H01B 1/023 (2013.01); H01B 1/026 (2013.01); H01B 3/20 (2013.01); H01B 7/2806 (2013.01); H01R 4/62 (2013.01); H01R 13/03 (2013.01); C10M 2223/043 (2013.01); C10N 2240/202 (2013.01);
Abstract

An electrical connection structure includes: a first metal member including copper or a copper alloy, a plated tin layer being formed on at least a portion of the first metal member; a second metal member that is electrically connected or connectable to the first metal member; and a surface treating layer formed on the surface of the first metal member. The surface treating layer is formed by applying a surface treating agent containing base oil and a metal affinity compound having a lipophilic group and an affinity group that has an affinity for metal. The metal affinity compound contains an adduct between an acidic alkyl phosphate ester and an azole compound and an adduct between an acidic alkyl phosphate ester and a metal and/or an organic amine compound.

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