The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Oct. 27, 2011
Applicants:
Eyal Peleg, Nes Ziona, IL;
Shahar Stein, Nes Ziona, IL;
Inventors:
Eyal Peleg, Nes Ziona, IL;
Shahar Stein, Nes Ziona, IL;
Assignee:
Hewlett-Packard Indigo B.V., Amstelveen, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41C 1/00 (2006.01); B29C 67/00 (2006.01); B44B 5/02 (2006.01); G03G 15/22 (2006.01);
U.S. Cl.
CPC ...
B44B 5/026 (2013.01); B41C 1/003 (2013.01); G03G 15/225 (2013.01); B29C 67/0051 (2013.01);
Abstract
An embossing die is created by printing multiple ink layers () in superposition thereby to build up a printed relief pattern () in accordance with received design data specifying a design to be embossed. The design data is modified after receipt to introduce into the printed relief pattern to be built, one or more channels () which extend depth-wise through multiple ink layers of the printed relief pattern () and serve to fully or partially segment the printed relief pattern.