The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Apr. 23, 2014
Applicant:

Toyo Seikan Group Holdings, Ltd., Tokyo, JP;

Inventors:

Norihisa Hirota, Kanagawa, JP;

Ikuo Komatsu, Kanagawa, JP;

Hiromitsu Fukuoka, Kanagawa, JP;

Atsushi Yoneda, Kanagawa, JP;

Kouichi Narutaki, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 49/04 (2006.01); B29C 49/30 (2006.01); B29C 49/42 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 49/4205 (2013.01); B29C 49/04 (2013.01); B29C 49/30 (2013.01); B29C 2049/044 (2013.01); B29K 2105/258 (2013.01);
Abstract

A parison supply device that continuously supplies, to a blow molding die, parison sections of a parison discharged from an extrusion die, the parison section having a specified length. The parison supply device includes a plurality of tension chucks and a tension chuck operation unit that operates the plurality of tension chucks. The tension chuck operation unit causes the individual tension chucks to perform a repeated operation of grasping the parison at a first position near the extrusion die and moving to a second position separated from the extrusion die such that, before the preceding tension chuck is separated by a set distance from the extrusion die at the second position, the following tension chuck grasps the parison at the first position, and then the parison section is supplied to the blow molding die.


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