The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Jan. 30, 2015
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Douglas E. Holmgren, Portland, OR (US);
Samuel C. Howells, Portland, OR (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/06 (2014.01); B23K 26/08 (2014.01); H01L 21/67 (2006.01); G02B 27/09 (2006.01); G02B 27/10 (2006.01); H01L 21/268 (2006.01); B23K 26/00 (2014.01); B23K 26/03 (2006.01); B23K 26/082 (2014.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0648 (2013.01); B23K 26/00 (2013.01); B23K 26/0006 (2013.01); B23K 26/034 (2013.01); B23K 26/06 (2013.01); B23K 26/0626 (2013.01); B23K 26/082 (2015.10); B23K 26/0807 (2013.01); B23K 26/0853 (2013.01); B23K 26/0876 (2013.01); G02B 27/0911 (2013.01); G02B 27/0961 (2013.01); G02B 27/0966 (2013.01); G02B 27/10 (2013.01); H01L 21/268 (2013.01); H01L 21/67115 (2013.01); B23K 2201/40 (2013.01); B23K 2203/56 (2015.10); G02B 27/09 (2013.01); H01L 24/80 (2013.01);
Abstract
Embodiments of the present disclosure relate to an apparatus for thermally processing a semiconductor substrate. In one embodiment, the apparatus includes a substrate support, a beam source having a fast axis for emitting a beam along an optical path intersecting the substrate support, and a homogenizer disposed along the optical path between the beam source and the substrate support. The homogenizer comprises a first lens array, and a second lens array, wherein lenses of the second lens array have a larger lenslet array spacing than lenses of the first lens array.