The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Nov. 28, 2012
Applicant:
Panasonic Corporation, Kadoma-shi, Osaka, JP;
Inventor:
Hideo Yamamoto, Hyogo, JP;
Assignee:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21D 5/16 (2006.01); B21D 22/20 (2006.01); B21D 11/18 (2006.01); B21D 26/027 (2011.01); B21D 26/053 (2011.01); B21D 28/10 (2006.01); B65B 3/02 (2006.01);
U.S. Cl.
CPC ...
B21D 5/16 (2013.01); B21D 11/18 (2013.01); B21D 22/203 (2013.01); B21D 22/208 (2013.01); B21D 26/027 (2013.01); B21D 26/053 (2013.01); B21D 28/10 (2013.01); B65B 3/022 (2013.01);
Abstract
A punch () and a pad () are opposed to each other such that a molded portion () of a metal laminate film () to be processed is interposed between the punch () and the pad (). An enclosed space () is compressed to raise only the temperature of the molded portion () while keeping the vicinity of the molded portion () at a low temperature (S, S). After that, the enclosed space () is moved with respect to the molded portion () to perform first molding (S) on the molded portion (), and then gas in the enclosed space () is released to perform second molding (S) on the molded portion () by means of the punch () and the pad ().