The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Dec. 23, 2013
Applicant:

Agency for Science, Technology and Research, Singapore, SG;

Inventors:

Kambiz Ansari, Singapore, SG;

Shilin Chen, Singapore, SG;

Christina Yuan Ling Tan, Singapore, SG;

Isabel Rodriguez, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 39/00 (2006.01); B01D 39/14 (2006.01); B01D 67/00 (2006.01); B01D 71/02 (2006.01); B01D 69/06 (2006.01); B01D 53/22 (2006.01); B01D 61/02 (2006.01); B01D 61/14 (2006.01); B01D 69/02 (2006.01); B01D 69/10 (2006.01); C25D 1/08 (2006.01); C25D 3/12 (2006.01); C25D 5/00 (2006.01); C25D 5/02 (2006.01); C25D 7/12 (2006.01);
U.S. Cl.
CPC ...
B01D 71/022 (2013.01); B01D 53/228 (2013.01); B01D 61/025 (2013.01); B01D 61/145 (2013.01); B01D 67/0053 (2013.01); B01D 67/0062 (2013.01); B01D 67/0069 (2013.01); B01D 69/02 (2013.01); B01D 69/06 (2013.01); B01D 69/10 (2013.01); B01D 69/105 (2013.01); C25D 1/08 (2013.01); C25D 3/12 (2013.01); C25D 5/003 (2013.01); C25D 5/022 (2013.01); C25D 7/123 (2013.01); B01D 2325/021 (2013.01);
Abstract

The present disclosure relates to a method of forming a metallic layer having pores extending therethrough, the method comprising the steps of: (a) contacting a cathode substrate with an electrolyte solution comprising at least one cation; reducing the cation to deposit the metallic layer on a surface of the cathode substrate; and (c) generating a plurality of non-conductive regions on the cathode substrate surface during reducing step (b); wherein the deposition of the metallic layer is substantially prevented on the non-conductive regions on the cathode substrate surface to thereby form pores extending through the deposited metallic layer. The present disclosure further provides a metallic porous membrane fabricated by the disclosed process.


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