The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Dec. 17, 2012
Applicant:

Trw Automotive Us Llc, Livonia, MI (US);

Inventors:

Mike Babala, Farmington Hills, MI (US);

Jesse Theissen, South Lyon, MI (US);

Assignee:

TRW Automotive U.S. LLC, Livonia, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/08 (2006.01); H05K 3/32 (2006.01); H05K 13/04 (2006.01); H01L 21/66 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0465 (2013.01); H01L 22/14 (2013.01); H01L 22/34 (2013.01); H05K 1/0268 (2013.01); H01L 2924/0002 (2013.01); H05K 1/181 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10727 (2013.01);
Abstract

Method and apparatus for bonding an electrical circuit component onto a substrate. A first electrically conductive bonding pad is formed on the component, and a second electrically conductive bonding pad is formed on the substrate. One of said first and second bonding pads is physically split into at least two parts, with electrical discontinuity between the two parts. An electrically conductive bond is formed between the first and second bonding pads such that electrical continuity is established from one part of the one bonding pad, through the other of the bonding pads, and through the second part of the one bonding pad. The integrity of the electrically conductive bond is evaluated by testing electrical continuity between the at least two parts.


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