The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2017
Filed:
Jan. 28, 2014
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Yoshitaka Yamaguchi, Kawasaki, JP;
Taisuke Iwai, Sagamihara, JP;
Masaaki Norimatsu, Atsugi, JP;
Yukie Sakita, Atsugi, JP;
Shinichi Hirose, Yokohama, JP;
Yohei Yagishita, Isehara, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H01L 21/50 (2013.01); H01L 23/373 (2013.01); H01L 23/3732 (2013.01); H01L 23/433 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); Y10T 428/24802 (2015.01); Y10T 428/24851 (2015.01);
Abstract
A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.