The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2017
Filed:
Apr. 08, 2013
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Yukihiro Hashi, Shiojiri, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 3/10 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H05K 1/02 (2006.01); H05K 3/24 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0091 (2013.01); H05K 1/111 (2013.01); H05K 1/183 (2013.01); H05K 3/10 (2013.01); H05K 3/108 (2013.01); H05K 3/3494 (2013.01); H05K 1/0284 (2013.01); H05K 3/243 (2013.01); H05K 3/321 (2013.01); H05K 2201/10083 (2013.01); H05K 2201/10371 (2013.01); H05K 2203/107 (2013.01); Y02P 70/611 (2015.11); Y10T 29/49155 (2015.01);
Abstract
An electronic device has a package and a piezoelectric element accommodated in an accommodating space formed inside the package. The package has a frame-like metallization layer bonding a base substrate and a lid together and electrodes formed on and in the base substrate and electrically connected with the piezoelectric element. The metallization layer is insulated from the electrodes.