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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9635768 B1

PDFFull Text
Date of Patent:
Apr. 25, 2017

Filed:

May. 26, 2015

Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Hyojae Bang, Hwasung-si, KR;

Dogeun Kim, Seoul, KR;

Hongkyun Kim, Sungnam-si, KR;

Youngbok Jeon, Seoul, KR;

Assignee:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Neil Abrams

Int. Cl.
CPC ...
H05K 5/00 (2006.01); G06K 7/00 (2006.01); H01R 12/57 (2011.01); H01R 12/50 (2011.01); H05K 1/11 (2006.01); H01R 13/00 (2006.01); H05K 3/10 (2006.01); H05K 3/30 (2006.01); H05K 7/02 (2006.01); H05K 13/00 (2006.01); G06F 1/18 (2006.01); H05K 1/18 (2006.01); H01R 27/00 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0026 (2013.01); G06F 1/18 (2013.01); G06F 1/185 (2013.01); G06K 7/0047 (2013.01); H01R 12/57 (2013.01); H01R 13/00 (2013.01); H01R 23/70 (2013.01); H05K 1/11 (2013.01); H05K 1/117 (2013.01); H05K 1/181 (2013.01); H05K 3/10 (2013.01); H05K 3/303 (2013.01); H05K 7/02 (2013.01); H05K 13/00 (2013.01); H01R 27/00 (2013.01); H05K 1/0295 (2013.01); H05K 3/3405 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/09709 (2013.01); H05K 2201/09954 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10446 (2013.01); Y10S 439/946 (2013.01); Y10S 439/951 (2013.01); Y10T 29/49124 (2015.01); Y10T 29/49147 (2015.01);
Abstract

Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices arid methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.

Find Patent Forward Citations

Bang, Hyojae. (2017). Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same (U.S. Patent No. 9635768). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9635768

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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