The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Jun. 17, 2014
Applicant:

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

Glenn A. Brigham, Chelmsford, MA (US);

Richard J. Stanley, Moultonborough, NH (US);

Bradley Thomas Perry, Nashua, NH (US);

Patrick J. Bell, Arlington, MA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/116 (2013.01); H05K 1/0222 (2013.01); H05K 3/4685 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09745 (2013.01); Y10T 29/49123 (2015.01);
Abstract

A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.


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