The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

May. 31, 2014
Applicants:

Sridharan Venk, Salem, MA (US);

Earl Alfred Picard, Jr., Portsmouth, NH (US);

Qi Dai, Peabody, MA (US);

Richard Garner, Arlington, MA (US);

Inventors:

Sridharan Venk, Salem, MA (US);

Earl Alfred Picard, Jr., Portsmouth, NH (US);

Qi Dai, Peabody, MA (US);

Richard Garner, Arlington, MA (US);

Assignee:

OSRAM SYLVANIA Inc., Wilmington, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/30 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); F21S 4/22 (2016.01); F21V 21/005 (2006.01); H01L 33/38 (2010.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/28 (2006.01); H01L 33/62 (2010.01); G06K 19/077 (2006.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); F21S 4/22 (2016.01); F21V 21/005 (2013.01); H01L 24/97 (2013.01); H01L 33/385 (2013.01); H05K 1/028 (2013.01); H05K 1/0296 (2013.01); H05K 1/118 (2013.01); H05K 3/30 (2013.01); G06K 19/07749 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 33/44 (2013.01); H01L 33/62 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/85424 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85447 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/1421 (2013.01); H05K 1/0209 (2013.01); H05K 1/189 (2013.01); H05K 3/0097 (2013.01); H05K 3/02 (2013.01); H05K 3/28 (2013.01); H05K 2201/051 (2013.01); H05K 2201/099 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/09736 (2013.01); H05K 2201/09872 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10522 (2013.01); H05K 2203/1545 (2013.01); Y02P 70/611 (2015.11); Y10T 29/4913 (2015.01);
Abstract

A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.


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