The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2017
Filed:
Mar. 06, 2012
Applicants:
Hidekazu Yoshihara, Tokyo, JP;
Akihiko Matsumaru, Tokyo, JP;
Taisuke Kimura, Tokyo, JP;
Atsushi Kajiya, Tokyo, JP;
Inventors:
Hidekazu Yoshihara, Tokyo, JP;
Akihiko Matsumaru, Tokyo, JP;
Taisuke Kimura, Tokyo, JP;
Atsushi Kajiya, Tokyo, JP;
Assignee:
Nippon Mektron, Ltd., Minato-Ku, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/02 (2013.01); H05K 1/023 (2013.01); H05K 1/183 (2013.01); H05K 3/285 (2013.01); H05K 1/028 (2013.01); H05K 1/185 (2013.01); H05K 3/281 (2013.01); Y10T 156/1043 (2015.01);
Abstract
Provided is a highly reliable flexible circuit body in which a flexible wiring board is prevented from wear caused by rubbing, and a method for production of the flexible circuit body. A flexible circuit body includes a flexible wiring board having an insulating film, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer. The flexible wiring board is coated with a thermoplastic elastomer.