The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2017
Filed:
Mar. 27, 2014
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Yeon Ho Son, Suwon-si, KR;
Kyung Su Park, Suwon-si, KR;
Seung Hyeon Jeong, Suwon-si, KR;
Joon Choi, Suwon-si, KR;
Assignee:
MPLUS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/08 (2006.01); H01L 41/053 (2006.01); B06B 1/06 (2006.01); H01L 41/047 (2006.01); H01L 41/09 (2006.01);
U.S. Cl.
CPC ...
H01L 41/053 (2013.01); B06B 1/0603 (2013.01); B06B 1/0662 (2013.01); H01L 41/0475 (2013.01); H01L 41/0933 (2013.01);
Abstract
Disclosed herein is a piezo vibration module, including: a piezo element having a pattern of an internal electrode printed therein and having an external electrode connected to the internal electrode disposed on an outer surface thereof; a flexible printed circuit board (FPCB) having each terminal and applying power to the external electrodes of the piezo element; and a conductive adhesive interposed between the piezo element and the FPCB to electrically connect the piezo element to the flexible printed circuit board.