The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2017
Filed:
Jun. 06, 2013
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Tomoko Higashiuchi, Tsukuba, JP;
Nobuaki Takane, Tsukuba, JP;
Masashi Yamaura, Tsukuba, JP;
Maki Inada, Tsukuba, JP;
Hiroshi Yokota, Chikusei, JP;
Assignee:
HITACHI CHEMICAL COMPANY, LTD, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01); H01L 33/52 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/486 (2013.01); H01L 33/52 (2013.01); H01L 33/60 (2013.01); H01L 33/44 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract
There is provided a production method for an optical semiconductor device including a substrate having a silver plating layer formed on a surface and a light emitting diode bonded to the silver plating layer. The production method includes a film formation step of forming a clay film covering the silver plating layer and a connection step of electrically connecting the light emitting diode and the silver plating layer covered with the clay film by wire bonding, after the film formation step.