The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2017
Filed:
May. 05, 2016
Applicant:
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Inventors:
Michael Kruppa, Geisenfeld, DE;
Simon Jerebic, Tegernheim, DE;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/58 (2010.01); H01L 33/50 (2010.01); H01L 33/48 (2010.01); H01L 33/52 (2010.01); B29D 11/00 (2006.01); G02B 1/04 (2006.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); G02B 27/09 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); B29D 11/00442 (2013.01); G02B 1/04 (2013.01); G02B 27/095 (2013.01); H01L 33/483 (2013.01); H01L 33/486 (2013.01); H01L 33/501 (2013.01); H01L 33/507 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/50 (2013.01); H01L 33/62 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01);
Abstract
A method of producing a semiconductor component includes providing an optoelectronic semiconductor chip; applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material; precuring the molding compound at a temperature of at most 50° C.; and curing the molding compound.