The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2017
Filed:
Jun. 10, 2014
Applicant:
Nichia Corporation, Anan-Shi, JP;
Inventor:
Takeo Kurimoto, Anan, JP;
Assignee:
NICHIA CORPORATION, Anan-Shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/08 (2010.01); H01L 33/56 (2010.01); G09F 9/33 (2006.01); H01L 25/075 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); G09F 9/302 (2006.01); H01L 33/44 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); G09F 9/3026 (2013.01); G09F 9/33 (2013.01); H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/44 (2013.01); H01L 33/60 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01);
Abstract
A light emitting device includes a package having a recess, a lead frame buried in the package so that one end of the lead frame is exposed at a bottom of the recess and another end protrudes to an exterior of the package, a light emitting element arranged on the lead frame exposed at the bottom of the recess, and an encapsulant filled in the recess. The package includes, at the side face where the lead frame protrudes, a first side face formed inwardly relative to a side face of the lead frame, and a second side face formed at a lower portion of the first side face and protruded so as to cover a top face of the lead frame.